Product Summary .
AOI automatique optical inspection equipment bɛ kɛ ka sanu nɛgɛ jɛgɛnw cogoya n’u tiɲɛni dɔn puce pakew kan. A bɛ baara kɛ ni High-Resolution 2D/3D kameraw ye ani AI ja baarakɛcogo algorisimuw ye walasa ka sanu nɛgɛw ɲɔgɔndanw dɔn teliya la ani k’u sɛgɛsɛgɛ cogo bɛnnen na chips pakew kan. A bɛ se ka paramɛtiriw dɔn i n’a fɔ welding cogoya, a jɔyɔrɔ, a janya, a bɔcogo, ani sanu nɛgɛ paramɛtiri wɛrɛw, ani ka anɔmali suguya caman walima fiɲɛ suguya caman dɔn, i n’a fɔ welding jugu, kari, offset, ani gɛlɛya wɛrɛw. Ni a ye gɛlɛyaw sɔrɔ joona ani ka u dilan ni sanu nɛgɛw ye, o bɛ dɛmɛ ka puce pakew ka ɲumanya n’u ka dannaya yiriwa ani ka dɔ bɔ chips hakɛ nafama na.
Aoi sanu fili bonding .
Fɛn minnu bɛ kɛ ka fɛnw dilan .
1.Gold wire bonding inspection .
Aw bɛ sirilanw (a ka c’a la, sanu, nɛgɛ walima aliminiyɔmu filiw) cogoya paramɛtɛrɛw dɔn, i n’a fɔ nɛgɛ arc janya, a janya, a jɔyɔrɔ, a cɛmancɛ, a cɛmancɛ, a kurulen, a kurulen, a kurukuruni ani a nafamafɛn wɛrɛw.
2.Solder Joint Quality Analysis .
Aw bɛ bondingɛ yɔrɔw dafalen lajɛ (solder joint fɔlɔ, solder joint filanan), i n’a fɔ offset, cold solder joint, pad contamination, etc.
3.3D cogoya labɛnni kokura .
Dɔw ka sanfɛ{0}}End modeli bɛ se ka 3D profile sumani sɔrɔ sanu nɛgɛ la ka tɛmɛ multi-angle optical imaging walima laser scanning fɛ.
Product Propriétés .
AOI minɛnw ka optique systeme kɛrɛnkɛrɛnnen ani detection algorithm bɛ kɛ ka caya- teliya, sanfɛ{1}}Sensitivity crystal defect detection and classification.
2d & 3d option, 3d sumani z-Axis accuracy fo ka se 8 μm ma .
UPH: A ka bon walima a bɛ bɛn 5000pcs/h ma .
AOI 2D dɔnni .
AOI 3D dɔnni .
Fɛn min bɛ kɛ ka fɛnw sɔrɔ .
● Aoi minɛnw sɛgɛsɛgɛli kɔnɔkow: nɛgɛ min ma sɔrɔ, nɛgɛ jugu, nɛgɛ fila, nɛgɛ fila, sanu fili tolen, sanu nɛgɛ kuru kuru, solder ball detachment, fishtail detachment, solder ball xy size, fishtail xy size, fishtail offset, creaved detachment, capaccitor offset, torccitor, tourtton, torcecol. Driver detaché IC, Driver driver IC, scratched photosensitive chip, tiɲɛni fotosensitive chip, nɔgɔ yeelenma puce.
AOI automatique optical inspection equipment ye jɛgɛnsira jɔnjɔn ye walasa ka dannaya sɔrɔ bonda kɛcogo la ani a bɛ baara kɛ kosɛbɛ semiconducteur back-End pakew ka jogoɲini na. Ni aw mago bɛ fura ɲuman na, aw bɛ se ka Huizhou Zhongke Advanced Manufacturing Co, Ltd.
Tags hot .: Otomatiki optique inspection equipement, China automatique optical inspection equipment dilannikɛlaw, feerekɛlaw, izini
Tekniki paramɛtɛrɛw .
● A ɲɛfɔli: 0,5μm~5μm (ka kɛɲɛ ni lensɛri labɛncogo ye) .
● Kɔlɔsili teliya: Kalansen caman fo tan ni caman segin kɔnɔ (a bɛ tali kɛ filɛli foro hakɛ la)
● A bɛ se ka kɛ ko a bɛ se ka kɛ: 15μm~100μm (Fire/copper wire) .
● Segin-ka-bɔnye: ±1μm3μm .
Fɛn minnu bɛ kɛ ka fɛnw ɲɛfɔ .
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Kɛnɛma bonya . |
L1000*W800*H1500 mm . |
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Kuranko . |
2KW, AC220 V . |
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Girinya |
800kg . |
