Industriw ka buguri bɔli minɛnw jɔyɔrɔba ye mun ye sugu la?

Sep 17, 2025 Aw bɛ cikan bila .

Industriw ka cogoya ani u ka yiriwali fɛn caman b’a la .

 

Sɔrɔdasiw ka sigida la, tɔn fanba bɛ fanga sɔrɔ mid- ani low-suguw laban na, k’u musaka kɛ-Nɔgɔya ni sigida baarakɛminɛnw dicogo. U bɛɛ laɲini ye ka don dɔɔnin dɔɔnin sanfɛ{4}} laban sugu la ni fɛɛrɛ kuraw ye.

 
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Ni sigida laminiko sariyaw ka gɛlɛn ani ka izini seko bonya ka kɛ motɛri fila ye minnu bɛ ɲininiw bila senkan, izini suguya caman bɛ ka dɔ fara u ka wari bilali kan buguri bɔli la, wa izini buguri bɔli minɛnw ɲinini fana bɛ ka bonya ka kɛɲɛ ni o ye.

 
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Industrie buguri bɔli minɛnw jɔyɔrɔ ka bon kosɛbɛ seko ni dɔnko siratigɛ caman na. Sɛnɛko siratigɛ la, iziniw i n’a fɔ siman, nɛgɛ, ani kemikɛliw bɛ u jigi da a kan walasa ka buguri bɔli kɔlɔsi min bɛ sɔrɔ sɛnɛfɛnw dilanni senfɛ ani ka sigida sariyaw labato. Elektroniki siratigɛ la, semiconductor wafer production ani precision electronic component manufacturing bɛ hali dɔɔnin ka kɔlɔsili gɛlɛn kɛ fɛnɲɛnamafagalanw kan minnu bonya bɛ se 0,1 micron ma.

 
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Industriw ka buguri bɔli minɛn kɔrɔlenw bɛ bugurimuguw laɲini a ka c’a la minnu ka bon ni mikron 5 ye, wa u tɛ se ka kɛ bugurijɛ 0,1 mikron 0,1 ye ani a ka dɔgɔn, bawo o fɛnɲɛnamafagalanw bɛ wuli kosɛbɛ ani ka don u kɔnɔ, o b’a to u minɛni ka gɛlɛn kosɛbɛ.

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Industriw ka yiriwali bɛ ka fɛɛrɛ kuraw bila sen kan fɛɛrɛko siratigɛ la buguri bɔli minɛnw na walasa ka sɛnɛfɛnw magow ɲɛ. Huizhou Zhongke Advanced Manufacturing Co., Ltd. ka MPC semiconductor sɛgɛsɛgɛli minɛnw bɛ se ka fɛn dilanni nafa n’a sɔrɔcogo ɲɛ kosɛbɛ, ka laadala bololabaarakɛcogo misaliw bila u nɔ na, ​​wa a bɛnnen don kɛrɛnkɛrɛnnenya la ka batch dilan min nafa ka bon-Fɛnw faralen ɲɔgɔn kan.

 

semiconductor-inspection-equipment0a502

MPC semiconductor sɛgɛsɛgɛli minɛnw ye buguri jalen bɔli sira ye min bɛ kɛ ni a yɛrɛ ye, CMOS ja sensɛriw kama. A bɛ ni kamera sanfɛla ye min ka bon kosɛbɛ min bɛ se ka ultrafine particulaire dunanfɛn dɔn ani ka buguri nɔrɔcogo ɲɛminɛ walasa ka sanfɛ-precision directional buguri bɔli kɛ. A bɛ Se ka dunan-fɛnw Bɔ minnu ka bon ni 700nm ye substrat/sensor kan. Masina in bɛ ni High-Speed ​​Servo module ye. Gara kelen/dusu bɛ se ka sugandi ka kɛɲɛ ni fɛn dilanni seko ye. A ka ca ni 5000pcs/h ye. A bɛ se ka rapɔɔriw bɔ ani ka kartiw ja dilan. O waati kelen na, kunnafoniw bɛ se ka bila kiliyan ka MES sitɛmu kɔnɔ.

 

 

Fɛn minnu bɛ kɛ ka fɛnw dilan ani u ka baarakɛcogo .

Ka baarakɛcogo ɲuman garanti kosɛbɛ .

Yɔrɔ dɔ sɔrɔli ni a saniyacogo, DB dɔnni .

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A daminɛ : (36pcs/tray, 10% buguri hakɛ)

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Single Station: >2500pcs/h; Double Station: >5000pcs/h .

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MPC micron particule cleaner system(for CMOS ja sensors) A bɛ a yɛrɛ lajɛ ani ka a dɔn ka ɲɛ .

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Saniya jalen, tolen-Fuuru, nɔgɔ tɛ

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Semiconductor sɛgɛsɛgɛli minɛnw sɛgɛsɛgɛli taabolo .

 

Fɛn min bɛ kɛ ka fɛnw sɔrɔ .

 

Semiconducteur (module optique, wafer) .

Semiconductor Packaging and Testing Industry (Sensor, IR Filter, IC Testing, Fingerprint Module)

 

 

 

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Dilanbaga minnu b’a fɛ ka MPC semiconductor sɛgɛsɛgɛli kɛ .

Minɛnw feerela dɔ sugandili ni fɛɛrɛ kɔgɔlenw ye, otomatiki hakɛ caman, nizɛri ɲɛnabɔli sekow, ani fɛn bɛɛ lajɛlen kɔfɛ{0}}feere baara ye fɛnba ye walasa ka se ka ɲɔgɔndan jɔnjɔnw yiriwa ani ka suguya nataw gɛlɛyaw kunbɛn. N’aw b’a fɛ ka an ka minɛnw sɔrɔ walima n’aw mago bɛ fura ɲuman na, aw bɛ se ka anw sɔrɔ an bɛna baara di aw ma min bɛ baara kɛ kosɛbɛ.